Output 1: 0-12V DC 0-3000A
Output 2: 0-15V DC 0-1500A
Power: 36kW + 22.5kW = 58.5kW Total
Application: Advanced Alkaline Copper Plating
Best For: Multi-Process Plating Lines PCB Manufacturing High-End Electronics
This dual pulse rectifier provides two independent power channels for advanced plating. The 3000A 12V output handles bulk deposition, while the 1500A 15V channel performs fine plating. Consequently, complex multi-stage processes are supported efficiently.
Parameter Specification
Input Power 480VAC Three-Phase
Output 1 0-12V DC 0-3000A Pulse/DC
Output 2 0-15V DC 0-1500A Pulse/DC
Pulse Frequency 1-1000 Hz Adjustable
Duty Cycle 5-95% Independent Control
Voltage Stability ≤ 0.3% Both Channels
Cooling System Water Cooling
Protections Independent OCP/OVP Thermal Isolation Fault Containment
Dual Independent Outputs
This dual pulse rectifier offers two separate channels. Therefore, different plating stages run simultaneously. Moreover, process flexibility increases significantly.
Advanced Pulse Control
Independent pulse parameters optimize each process. Specifically, frequency and duty cycle adjust separately. Thus, plating results improve dramatically.
High-Current Capability
3000A capacity handles large surface areas. Furthermore, 1500A supports precision work. Consequently, production versatility expands.
Intelligent Process Sequencing
Channels can operate sequentially or concurrently. Additionally, timing delays are programmable. Hence, complex plating cycles are automated.
This dual pulse rectifier serves sophisticated plating applications requiring multiple processes.
In Multi-Stage PCB Manufacturing
Channel 1 plates power layers at 3000A. Channel 2 handles signal layers at 1500A. Importantly, different requirements are met simultaneously.
For High-End Electronics
The system processes complex components with varying needs. Similarly, different areas receive optimized treatment. Consequently, product performance enhances.
In Advanced Research Applications
Independent channels allow experimental comparisons. Ultimately, process parameters can be tested side-by-side. Therefore, development accelerates.
For Specialized Industrial Plating
Different substrates receive appropriate treatment. Specifically, each channel suits particular requirements. Thus, production efficiency maximizes.
Production efficiency improves with parallel processing. Moreover, changeover time between stages eliminates. Consequently, throughput increases substantially.
Process quality enhances through optimized parameters. Furthermore, each plating stage receives ideal conditions. Therefore, final product quality improves.
Energy efficiency optimizes with targeted power delivery. Additionally, idle time between processes reduces. Thus, operational costs decrease.
Flexibility expands for diverse production requirements. Specifically, the dual system adapts to various products. Hence, market responsiveness improves.
In summary, this dual pulse rectifier represents advanced plating technology. For this reason, it serves applications where multiple processes, high precision, and production efficiency are critical requirements for competitive manufacturing.